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AES Analysis of Au, Au/Cr, Au/Ni/Cr and Au/Pd/Cr Thin Films by the Change of Substrate Temperature and Annealing Temperature
Analytical Science and Technology / Analytical Science and Technology, (P)1225-0163; (E)2288-8985
1993, v.6 no.2, pp.217-223
Yoo,
K. S., &
Jung,
H.
J.
(1993). AES Analysis of Au, Au/Cr, Au/Ni/Cr and Au/Pd/Cr Thin Films by the Change of Substrate Temperature and Annealing Temperature. Analytical Science and Technology, 6(2), 217-223.
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Abstract
Thin films of the Au/Cr, Au/Ni/Cr and Au/Pd/Cr systems were deposited on alumina substrates at ambient temperature and <TEX>$250^{\circ}C$</TEX> in a high-vacuum resistance heating evaporator and annealed at <TEX>$300^{\circ}C$</TEX>, <TEX>$450^{\circ}C$</TEX> and <TEX>$600^{\circ}C$</TEX> for 1 hour in air, respectively. The film thicknesses of Au, Ni(or pd), and Cr were <TEX>$1000{\AA}$</TEX>, <TEX>$300{\AA}$</TEX>, and <TEX>$50{\AA}$</TEX>, respectively. The substrate temperature during deposition and the post-deposition annealing temperature affected the sheet resistance of thin-films due to the inter-diffusion of each layer. As a result of Auger depth profile analysis, in the Au/Cr system Cr already diffused out to Au surface during deposition at the substrate temperature of <TEX>$250^{\circ}C$</TEX> and Au distribution changed after heat treatment. In the Au/Ni/Cr and Au/Pd/Cr systems, diffusion phenomena of Ni and Pd were found and especially Ni (approximately 45 at.%) diffused out to Au surface and oxidized.
- keywords
- AES analysis, Au thin film, Inter-diffusion
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